SAFETY: Laser safety eyewear, ventilation, fire extinguisher, and secure mounting required. Never leave unattended.
Calculate Epoxy Thickness
Size Profile (Quick Select)
Package Information
Physical Measurements (mm)
Generate G-Code
✓ Calibration Active - All coordinates will be corrected automatically.
GRBL Configuration
GRBL Mode: Generates proper M3/M4 commands. Check your $30 setting first. M3: Constant power (recommended for precision work) M4: Dynamic power (scales with speed - may cause uneven cuts at line ends)
Package Dimensions
Full package outer width
Full package outer height
IC Package Type (Semiconductor Decapping)
Quick Setup: Select your IC package type to auto-configure optimal decapping parameters (power curve, depth strategy, die protection)
Custom Package
Configure manually below
Adaptive Power Control (APC)
Safety Feature: Automatically reduces laser power as you approach the die surface to prevent damage
Total package thickness to remove
Power limit in final 50µm
Stop distance above die
Power Curve: 100% → 80% → 60% → 30% → 15% (auto-calculated based on depth)
Multi-Pass Strategy
Advanced Mode: Enable semiconductor-optimized multi-pass ablation with automatic power/speed adjustments per pass
More passes = finer control
Cooling time between passes
Enable multi-pass mode to see pass strategy preview
Die Protection Zone
Critical Safety: Define the die location to enable protection. System will automatically reduce power/speed or skip the die area.
Selective Ablation Zones
Zone Mode: Define specific areas to ablate. Leave in "Full Die Area" mode for complete coverage.
Edge Mode: Ablates around the perimeter of the package to remove epoxy securing it to the PCB.
Width of the perimeter trace around the package
Offset from package edge (negative = inward, positive = outward)
Laser Parameters
Focused height above bed (typically 5-15mm)
G-Code Output
Estimated Time:—
Profile Parameters Used
; Click "Generate G-Code" to create your program
Preview: Blue = scan path, Green = zones, Red = die outline
Machine Calibration
Purpose: Compensate for mechanical slop, backlash, and positioning inaccuracies in your laser system.
Use the calibration pattern to measure actual vs. commanded positions, then apply corrections.
Calibration Status
Not Calibrated
No calibration applied. All coordinates are uncorrected.
Calibration Method
Calibration Test Pattern Generator
Size of calibration square (should fit on test material)
Instructions:
1. Generate and run the calibration pattern on test material
2. Measure actual positions of marks using calipers or ruler
3. Enter measured values in the table below
4. System will calculate correction factors automatically
Point
Commanded X (mm)
Commanded Y (mm)
Measured X (mm)
Measured Y (mm)
Error X
Error Y
Manual Calibration Offsets
Advanced: Only use if you know your machine's specific offsets. Test pattern method is recommended.